Alloy Considerations for Low Temperature Lead Free Soldering 7/13/18

SMTA Dallas Chapter

Speaker: Joe Cumbey, Alpha Assembly Materials

Event Details

  • Who: SMTA Members, Non-members, Students, and Guests are welcome – forward to others!
  • When: 11am-1pm on July 13, 2018
  • Where: Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
  • Why: Meet others in the industry to help solve your technical problems. Come to the meeting, even if this isn’t a key topic of yours, the problem solving networking is great!

Pricing

  • FREE for New Members since prior meeting
  • $10 for Committee Members
  • $20 Members, employees of Corporate member companies, 1st time guests, and students
  • $25 non-members, students, & guests – same price
  • Cash at the door or credit card on-line

10% Early-bird Discount for paying on-line before 5:00pm on June 11th! Get your tickets!

Abstract

I will discuss the alloy options, their respective melt points, process requirements, and respective strength and reliability characteristics.

  1. Alloy Considerations for Low Temperature Lead Free Soldering
  2. The Effect of Additives on Sn Based Alloys
  3. Understanding Low Temp Sn-Bi Alloys
  4. Eutectic Sn-Bi Solders
  5. Non-Eutectic Sn-Bi Solders
  6. HRL1 Solder Alloy
  7. The Importance of Using the Right Chemistry

Biography

Joe Cumbey began his career as a Production Engineer in Electronics Manufacturing in 1982, working in all areas of printed circuit board assembly operations for various Commercial, Military, Industrial, and Aerospace manufacturers in Florida and Arizona. He joined Alpha in 1997 as a District Sales Manager, and now serves as an Alpha Regional Sales Manager covering Alpha Assembly Materials sales in the US and Canada.

Joe earned his Bachelor of Science in Engineering degree from Purdue University in 1982.

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