Gary Tanel is the founder and principle of Electronic Alliance which offers solutions in contract design and manufacturing services to OEMs leveraging his strategic relationships with quality providers. Gary also offers consulting services through TechBiz Consulting LLC.
Mr. Tanel offers more than 25 years of leadership in design and manufacturing operational experience along with entrepreneurial experience in electronics. As an ambassador of the international SMTA, Mr. Tanel has been serving that association as an officer since 1993 and was on the board of directors for 6 years. He is also the TechTitans Design and Manufacturing Forum chairman.
background
Mr. Tanel began his professional career after becoming a mechanical engineer from Marquette University and a registered professional engineer in the state of Texas. He began with Texas Instruments and rose through the ranks over his 20 years there to the position of Technology Development Manager for military electronic manufacturing. Gary was also the director of manufacturing for a start-up high-technology operation called Micro-ASI in 1999. In 2001 Mr. Tanel was the founder of the New Product Resource Center in Dallas Texas with the core competency of building electronic prototypes using state-of-the-art equipment and manufacturing processes. He sold his business to a large international electronics manufacturing firm that was searching for top technology capability and customer relationships in the United States. Then as Sr. Vice President of the Associate Equity Group (working Mergers and Acquisitions in EMS) Gary founded the Dallas M&A Forum in 2008 which continues today. He was president of Circuitronics (an EMS company) to turn the company around in 2009 with ERP, Lean manufacturing, and sales growth. Gary was a monthly columnist for SMT Magazine writing 27 columns called “the EMS corner” and has been on the editorial advisory board.
awards
Gary Tanel is the winner of the “Founder’s Award” and the “Excellence in Leadership” award from SMTA International, the “Quality Award for Excellence” from Texas Instruments, the “Service Excellence” award from Circuits Assembly Magazine, and the “Servant Leadership” award from CEO Netweavers.
Biography of:
Dr. Viswam Puligandla
Independent Research Professional
Background
Dr. Viswam Puligandla, has well over three decades of experience in the Electronic Packaging industry and has worked at such illustrious companies as International Business Machines, Texas Instruments, Raytheon, and Nokia. He has several years of teaching experience at both the undergraduate and graduate level at University of Texas at Arlington in Arlington,Texas. He brings electronic packaging and microelectronics experience of business computers, personal computers, military electronics, and consumer portable electronics. Specific areas of expertise include first- and second-level packaging comprising Fine Pitch packaging, Area Array packaging, Chip Scale packaging, and more, as well as Printed Wiring Board fabrication, High Density Interconnect, Reliability Engineering & Reliability Enhancement with non-reworkable and reworkable underfills, and Failure Analysis. He was actively involved in the development and implementation of Lead (Pb)–free solders.
Dr. Puligandla authored/co-authored three books:
- Failure Modes and Mechanisms in Electronic Packages,
- Portable Consumer Electronics, and
- Essentials of Electronic Packaging.
In addition to these, he authored ten book chapters covering such areas as Fine Pitch Packaging, Ball Grid Array Packaging, Chip Scale Packaging, Lead Free Electronics, Adhesion in Electronics, Reliability Aspects of Portable Electronics, and more. He also authored well over 125 technical papers in the field of Materials Science and Electronics Packaging.
As an educator he presented several tutorials at SMTA-International, IPC, and IMAPS conferences, as well as at several local SMTA chapters. He has been active in the SMTA organization at national level, as a member of the Board, on the Journal Review Committee, and as Technical Advisor in the Dallas Chapter.
Viswam has been an Adjunct Faculty at University of Texas at Arlington teaching Fundamentals of Electronic Packaging, Failures and Their Prevention in Electronic Packages, and Advance Packaging. Viswam was also on the advisory panel for U. T. Arlington Ph.D. program.
Awards
He is recepient of several awards inclusing IBM Third Plateau Invention Achievement Award, an IBM Excellence Award, Three Technical Author Recognition Program (TARP) Awards, and most recently Member of Technical Distinction Award by the SMTA.
Patents
As an inventor, Viswam has nine issued patents in different areas of packaging and vacuum science.